If you look at the top of the figure, you will notice that there are four distinct zones to the reflow profile: “Preheat”, “Soak”, “Reflow”, and “Cool Down”. The image shown above is a reflow profile for a popular leaded solder paste. The recommended reflow profile when using Kester EP256, a leaded solder paste. Some Background Information About Reflow Soldering Profiles We share our first 3 trials at the end of this post, along with some of the challenges we encountered.
As each reflow oven is different (our first one is an old toaster oven, the building of which is detailed here), the reflow profile will likely need to be adjusted to get good results with your own oven. We will cover reflow profiles and briefly discuss their different aspects. In the picture above, solder paste has been applied to the circuit board and is awaiting part placement and reflow soldering.Īs mentioned in our last post detailing moisture sensitivity levels and the need to bake parts, this post dives into enabling reflow soldering using a Tiny Reflow Controller V2 by Rocket Scream. The automation possible as well as the overall quality of solder joints make it an easy choice for most electronics projects. Today, reflow soldering is what makes every cell phone and almost every consumer electronic device work. Reflow soldering is a relatively recent addition to the electronics industry, ushered in to allow the usage of SMT (surface mount technology) parts. It was a bit light on the larger pads but volume was sufficient for good fillets. EVEN IF THE PARTY HAS RECIEVED PRIOR NOTICE OF THE POSSIBILITY OF SUCH CLAIMS, DEMANDS, OR DAMAGES.Solder paste applied to a micro USB footprint.
REFLOW PROFILE SOFTWARE
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REFLOW PROFILE FOR FREE
Members and partners can download a member demo version of the calculator for free from the website.Ī full version is also for sale. Default values and weight-based estimations for these parameters are provided in the tool. The tool uses the thermal capacity and conductivity of components and the PCB as well as the convective heat transfer coefficient of the oven to determine the solder joint temperature obtained during the reflow process.
REFLOW PROFILE OFFLINE
Offline reflow profile prediction for a specific PBA and reflow oven, based on the Bill-of-Material and PCB build-up of the PBA and the oven heating characteristics.Offline reflow profile prediction based on reflow profiles obtained on a different PBA and/or in a different reflow oven.Offline reflow profile optimization for a specific PBA and reflow oven, based on a single reflow profile measurement.The 'Reflow Profile Calculator' supports the following applications that are related to convective reflow soldering of electronic assemblies:
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